tzx2v4 thru tzx36 500mw silicon zener diodes features x very sharp reverse characteristic x low reverse current level x very high stability x available with tighter tolerances maximum ratings* symbol value units ma x . st e ad y state po we r d iss ipa tion a t t l =2 5 o c , i = 4mm p d 50 0 mw junction temperature t j 175 : storage temperature range t s t g - 65 to 175 : th er mal r e s ista nc e( j u n c t io n to am b ient ) r t h j a 3 0 0 k / w electrical characteristics @ 25 q c unless otherwise specified symbol maximum unit ma x . for w ard voltag e @ i f =100ma v f 1.5 v mechanical data x c a s e: s tandard glass case
omp onents 20736 marilla street chatsworth
mcc do-35 dimensions inches mm dim min max min max note a --- .166 - - - 4.2 b --- .079 - - - 2.00 c --- .020 - - - .52 d 1.000 --- 25.40 --- a b c d d cathode mark revision: a 20 11 / 01 / 01 tm micro commercial components ? marking : cathode band and type number www . mccsemi .com 1 of 7 ? lead free finish/rohs compliant (note1) ("p"suffix designates compliant. see ordering information) note: 1. lead in glass exemption applied, see eu directive annex 7(c)-i. moisture sensitivity level 1 http://
mcc tm micro commercial components www. mccsemi .com revision: a 20 11 /0 1 / 01 2 of 7 tzx2v4 thru tzx36 t ype v zmin. v zmax. type v zmin. v zmax. r zmax. at i z i rmax. at v r (v) (v) (v) (v) ( ) (ma) ( a) (v) tzx2v4 2.3 2.6 tzx2v4a 2.3 2.5 100 5 5 0.5 tzx2v4 2.3 2.6 tzx2v4b 2.4 2.6 100 5 5 0.5 tzx2v7 2.5 2.9 tzx2v7a 2.5 2.7 100 5 5 0.5 tzx2v7 2.5 2.9 tzx2v7b 2.6 2.8 100 5 5 0.5 tzx2v7 2.5 2.9 tzx2v7c 2.7 2.9 100 5 5 0.5 tzx3v0 2.8 3.2 tzx3v0a 2.8 3.0 100 5 5 0.5 tzx3v0 2.8 3.2 tzx3v0b 2.9 3.1 100 5 5 0.5 tzx3v0 2.8 3.2 tzx3v0c 3.0 3.2 100 5 5 0.5 tzx3v3 3.1 3.5 tzx3v3a 3.1 3.3 100 5 5 1 tzx3v3 3.1 3.5 tzx3v3b 3.2 3.4 100 5 5 1 tzx3v3 3.1 3.5 tzx3v3c 3.3 3.5 100 5 5 1 tzx3v6 3.4 3.8 tzx3v6a 3.4 3.6 100 5 5 1 tzx3v6 3.4 3.8 tzx3v6b 3.5 3.7 100 5 5 1 tzx3v6 3.4 3.8 tzx3v6c 3.6 3.8 100 5 5 1 tzx3v9 3.7 4.1 tzx3v9a 3.7 3.9 100 5 5 1 tzx3v9 3.7 4.1 tzx3v9b 3.8 4.0 100 5 5 1 tzx3v9 3.7 4.1 tzx3v9c 3.9 4.1 100 5 5 1 tzx4v3 4.0 4.5 tzx4v3a 4.0 4.2 100 5 5 1.5 tzx4v3 4.0 4.5 tzx4v3b 4.1 4.3 100 5 5 1.5 tzx4v3 4.0 4.5 tzx4v3c 4.2 4.4 100 5 5 1.5 tzx4v3 4.0 4.5 tzx4v3d 4.3 4.5 100 5 5 1.5 tzx4v7 4.4 4.9 tzx4v7a 4.4 4.6 100 5 5 2 tzx4v7 4.4 4.9 tzx4v7b 4.5 4.7 100 5 5 2 tzx4v7 4.4 4.9 tzx4v7c 4.6 4.8 100 5 5 2 tzx4v7 4.4 4.9 tzx4v7d 4.7 4.9 100 5 5 2 tzx5v1 4.8 5.3 tzx5v1a 4.8 5.0 100 5 5 2 tzx5v1 4.8 5.3 tzx5v1b 4.9 5.1 100 5 5 2 tzx5v1 4.8 5.3 tzx5v1c 5.0 5.2 100 5 5 2 tzx5v1 4.8 5.3 tzx5v1d 5.1 5.3 100 5 5 2 tzx5v6 5.2 5.9 tzx5v6a 5.2 5.5 40 5 5 2 tzx5v6 5.2 5.9 tzx5v6b 5.3 5.6 40 5 5 2 tzx5v6 5.2 5.9 tzx5v6c 5.4 5.7 40 5 5 2 tzx5v6 5.2 5.9 tzx5v6d 5.5 5.8 40 5 5 2 tzx5v6 5.2 5.9 tzx5v6e 5.6 5.9 40 5 5 2 tzx6v2 5.7 6.6 tzx6v2a 5.7 6.0 15 5 1 3 tzx6v2 5.7 6.6 tzx6v2b 5.8 6.1 15 5 1 3 tzx6v2 5.7 6.6 tzx6v2c 6.0 6.3 15 5 1 3 tzx6v2 5.7 6.6 tzx6v2d 6.1 6.4 15 5 1 3 tzx6v2 5.7 6.6 tzx6v2e 6.3 6.6 15 5 1 3 tzx6v8 6.4 7.2 tzx6v8a 6.4 6.7 15 5 1 3.5 tzx6v8 6.4 7.2 tzx6v8b 6.6 6.9 15 5 1 3.5 tzx6v8 6.4 7.2 tzx6v8c 6.7 7.0 15 5 1 3.5 tzx6v8 6.4 7.2 tzx6v8d 6.9 7.2 15 5 1 3.5 tzx7v5 7.0 7.9 tzx7v5a 7.0 7.3 15 5 1 5.0 tzx7v5 7.0 7.9 tzx7v5b 7.2 7.6 15 5 1 5.0
mcc tm micro commercial components www. mccsemi .com revision: a 20 11 /0 1 / 01 3 of 7 tzx2v4 thru tzx36 t ype v zmin. v zmax. type v zmin. v zmax. r zmax. at i z i rmax. at v r (v) (v) (v) (v) ( ) (ma) ( a) (v) tzx7v5 7.0 7.9 tzx7v5c 7.3 7.7 15 5 1 5.0 tzx7v5 7.0 7.9 tzx7v5d 7.5 7.9 15 5 1 5.0 tzx8v2 7.7 8.7 tzx8v2a 7.7 8.1 20 5 1 6.2 tzx8v2 7.7 8.7 tzx8v2b 7.9 8.3 20 5 1 6.2 tzx8v2 7.7 8.7 tzx8v2c 8.1 8.5 20 5 1 6.2 tzx8v2 7.7 8.7 tzx8v2d 8.3 8.7 20 5 1 6.2 tzx9v1 8.5 9.7 tzx9v1a 8.5 8.9 20 5 1 6.8 tzx9v1 8.5 9.7 tzx9v1b 8.7 9.1 20 5 1 6.8 tzx9v1 8.5 9.7 tzx9v1c 8.9 9.3 20 5 1 6.8 tzx9v1 8.5 9.7 tzx9v1d 9.1 9.5 20 5 1 6.8 tzx9v1 8.5 9.7 tzx9v1e 9.3 9.7 20 5 1 6.8 tzx10 9.5 10.6 tzx10a 9.5 9.9 25 5 1 7.5 tzx10 9.5 10.6 tzx10b 9.7 10.1 25 5 1 7.5 tzx10 9.5 10.6 tzx10c 9.9 10.3 25 5 1 7.5 tzx10 9.5 10.6 tzx10d 10.2 10.6 25 5 1 7.5 tzx11 10.4 11.6 tzx11a 10.4 10.8 25 5 1 8.2 tzx11 10.4 11.6 tzx11b 10.7 11.1 25 5 1 8.2 tzx11 10.4 11.6 tzx11c 10.9 11.3 25 5 1 8.2 tzx11 10.4 11.6 tzx11d 11.1 11.6 25 5 1 8.2 tzx12 11.4 12.7 tzx12a 11.4 11.9 35 5 1 9.5 tzx12 11.4 12.7 tzx12b 11.6 12.1 35 5 1 9.5 tzx12 11.4 12.7 tzx12c 11.9 12.4 35 5 1 9.5 tzx12 11.4 12.7 tzx12d 12.2 12.7 35 5 1 9.5 tzx13 12.4 13.4 tzx13a 12.4 12.9 35 5 1 10 tzx13 12.4 13.4 tzx13b 12.6 13.1 35 5 1 10 tzx13 12.4 13.4 tzx13c 12.9 13.4 35 5 1 10 tzx14 13.2 14.3 tzx14a 13.2 13.7 35 5 1 11 tzx14 13.2 14.3 tzx14b 13.5 14.0 35 5 1 11 tzx14 13.2 14.3 tzx14c 13.8 14.3 35 5 1 11 tzx15 14.1 15.5 tzx15a 14.1 14.7 40 5 1 11.5 tzx15 14.1 15.5 tzx15b 14.5 15.1 40 5 1 11.5 tzx15 14.1 15.5 tzx15c 14.9 15.5 40 5 1 11.5 tzx16 15.3 17.1 tzx16a 15.3 15.9 45 5 1 12 tzx16 15.3 17.1 tzx16b 15.7 16.5 45 5 1 12 tzx16 15.3 17.1 tzx16c 16.3 17.1 45 5 1 12 tzx18 16.9 19.0 tzx18a 16.9 17.7 55 5 1 13 tzx18 16.9 19.0 tzx18b 17.5 18.3 55 5 1 13 tzx18 16.9 19.0 tzx18c 18.1 19.0 55 5 1 13 tzx20 18.8 21.2 tzx20a 18.8 19.7 60 2 1 15 tzx20 18.8 21.2 tzx20b 19.5 20.4 60 2 1 15 tzx20 18.8 21.2 tzx20c 20.2 21.2 60 2 1 15 tzx22 20.9 23.3 tzx22a 20.9 21.9 65 2 1 17 tzx22 20.9 23.3 tzx22b 21.6 22.6 65 2 1 17 tzx22 20.9 23.3 tzx22c 22.3 23.3 65 2 1 17 tzx24 22.9 25.5 tzx24a 22.9 24.0 70 2 1 19 tzx24 22.9 25.5 tzx24b 23.6 24.7 70 2 1 19
characteristics (t j = 25 c unless otherwise specified) 95 9611 0 5 10 15 0 100 200 300 400 500 20 r therm. resist. junction / ambient ( k/w ) thja l lead length ( mm ) ll t l =constant figure 1. thermal resistance vs. lead length 0 40 80 120 160 0 100 300 400 500 600 p t otal power dissipation ( mw ) tot t amb ambient t emperature ( c ) 200 95 9602 200 figure 2. total power dissipation vs. ambient temperature mcc tm micro commercial components www. mccsemi .com revision: a 20 11/01/01 4 of 7 tzx2v4 thru tzx36 t ype v zmin. v zmax. type v zmin. v zmax. r zmax. at i z i rmax. at v r (v) (v) (v) (v) ( ) (ma) ( a) (v) tzx24 22.9 25.5 tzx24c 24.3 25.5 70 2 1 19 tzx27 25.2 28.6 tzx27a 25.2 26.6 80 2 1 21 tzx27 25.2 28.6 TZX27B 26.2 27.6 80 2 1 21 tzx27 25.2 28.6 tzx27c 27.2 28.6 80 2 1 21 tzx30 28.2 31.6 tzx30a 28.2 29.6 100 2 1 23 tzx30 28.2 31.6 tzx30b 29.2 30.6 100 2 1 23 tzx30 28.2 31.6 tzx30c 30.2 31.6 100 2 1 23 tzx33 31.2 34.5 tzx33a 31.2 32.6 120 2 1 25 tzx33 31.2 34.5 tzx33b 32.2 33.6 120 2 1 25 tzx33 31.2 34.5 tzx33c 33.2 34.5 120 2 1 25 tzx36 34.2 38.0 tzx36a 34.2 35.7 140 2 1 27 tzx36 34.2 38.0 tzx36b 35.3 36.8 140 2 1 27 tzx36 34.2 38.0 tzx36c 36.4 38.0 140 2 1 27
0 5 10 15 20 1 10 100 1000 v v oltage change ( mv ) z v z z-v oltage ( v ) 25 95 9598 i z =5ma t j =2 5 c figure 3. t ypical change of w orking v oltage under operating conditions at t amb =25 c 60 0 60 120 180 0.8 0.9 1.0 1.1 1.2 1.3 v relative v oltage change ztn t j junction t emperature ( c ) 240 95 9599 v ztn =v zt /v z (25 c) tk vz =10 10 4 /k 8 10 4 /k 4 10 4 /k 6 10 4 /k 4 10 4 /k 2 10 4 /k 2 10 4 /k 0 figure 4. t ypical change of w orking v oltage vs. junction t emperature 01 0 2 030 5 0 5 10 15 tk t emperature coef ficient of v ( 10 /k ) vz v z z-v oltage ( v ) 50 95 9600 40 z 4 i z =5ma figure 5. temperature coefficient of vz vs. zvoltage 0 5 10 15 0 50 100 150 200 c diode capacitance ( pf ) d v z z-v oltage ( v ) 25 95 9601 20 t j =25 c v r =2v figure 6. diode capacitance vs. zv oltage 0 0.2 0.4 0.6 0.8 0.001 0.01 0.1 1 10 100 1.0 95 9605 i forward current ( ma ) f v f forward v oltage ( v ) t j =2 5 c figure 7. forward current vs. forward v oltage 04 8 1216 20 95 9604 0 20 40 60 80 100 i z-current ( ma ) z v z z-v oltage ( v ) p tot =500mw t amb =25 c figure 8. zcurrent vs. zvoltage mcc tm micro commercial components www. mccsemi .com revision: a 20 11/01/01 5 of 7 tzx2v4 thru tzx36
15 20 25 30 0 10 20 30 40 50 i z-current ( ma ) z v z z-v oltage ( v ) 35 95 9607 p tot =500mw t amb =25 c figure 9. zcurrent vs. zv oltage 0 5 10 15 20 1 10 100 1000 r dif ferential z-resistance ( ) z v z z-v oltage ( v ) 25 95 9606 t j =25 c i z =1ma 5ma 10ma figure 10. differential zresistance vs. zvoltage 1 10 100 1000 z thermal resistance for pulse cond. (k/w) thp t p pulse length ( ms ) 95 9603 10 1 10 0 10 1 10 2 t p /t=0.5 t p /t=0.2 t p /t=0.1 t p /t=0.05 t p /t=0.02 t p /t=0.01 single pulse r thja =300k/w t=t jmax t amb i zm =(v z +(v z 2 +4r zj t/z thp ) 1/2 )/(2r zj ) figure 11. thermal response mcc tm micro commercial components www. mccsemi .com tzx2v4 thru tzx36 revision: a 20 11/01/01 6 of 7
mcc revision: a 2011/01/01 tm micro commercial components www. mccsemi .com 7 of 7 d e vi c e p ac k i n g p a r t n u m b e r- t p t a p e & r ee l : 10 k p c s / r e e l p a r t n u m b e r- a p a m m o p a c k i n g : 5 k p c s / a mm o b o x p a r t n u m b e r - bp b u l k: 10 0 k p c s / c a r t o n o r de r i n g i n f or m a ti on : *** i m p o r t a n t n o t ic e * ** m i c r o c o m m e r c i a l c o m p on e n ts c o r p . r e s e rve s t h e r i g h t t o m a k e c h a n g e s w i t ho u t f u r t h e r no t i c e t o a n y p r o d u c t h e r e i n t o m a k e c o rr e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m pr o v e m e n t s , o r o t h e r ch a n g e s . m i c r o c o m m e r c i a l c o mp o n e n ts c o r p . d o e s n o t a s s u m e a n y l i a b i l i t y a r i s i n g ou t o f t h e a p p l i c a t i on o r u s e o f a n y p r o d uc t d e sc r i be d h e r e i n ; n e i t h e r d o e s i t c o n v e y a n y li c e n s e un der i t s p a t e n t r i g h t s , n o r t h e r i g h t s o f o t h e r s . t h e u s e r o f pr o d uc t s i n s u c h a p p l i c a t i o n s sh a l l a ss u m e a l l r i s k s o f su c h u s e a n d w ill a g r ee t o h o l d m i c r o c o mm er c i a l c o m p o n e n t s c o r p . a n d a ll t h e c o m p a n i e s w ho s e p r o d u c t s a r e r e p r e s e n t ed o n ou r w e b s i t e , h a r m l e s s a g a i n s t a l l d a m a g e s. * * * l i f e s u p p o r t *** m c c ' s pr o d uc t s a r e n o t a u t h o r iz ed f o r u s e a s c r i t i c a l c o m p o n e n t s i n l i f e s u pp o r t d e v i c e s o r s y s t e m s w i t h ou t t h e e x pre ss wr i tt e n a p p r o v a l o f m i c r o c o mm e r c i a l c o m p o n e n t s c o rp o r a t i o n. * * * c u s t o m e r a w a r e n e ss*** c o un t e r f e i t i n g o f s e m i c o n d u c t o r p a r t s i s a gr o w i n g p r o b l e m i n t h e i n d u s t ry . m i c r o c o mm e r c i a l c o m p o n e n t s ( m cc ) i s t a k i n g s t r o n g m e a su r e s t o p r o t e c t ou r s e l v e s a n d o u r cu s t o m e r s f r o m t h e pr o l i f e r a t i on o f c o u n t e r f e i t p a r t s . m c c s t r o n g l y e nc o u r a g e s c u s t o m e r s t o p u r c h a s e m c c p a r t s e i t h e r d i r e c t l y f r o m m c c o r f r o m a u t ho r i z e d m c c d i s t r i b u t o r s w ho a r e l i s t e d b y c o u n t r y o n o u r w e b p a g e c i t ed below . p r o d uc t s c us t o m e r s b u y e i t h e r f r o m m c c d i r e c t l y o r f r o m a u t ho r i z e d m cc d i s t r i b u t o r s a r e g e n u i n e p a r t s , h a v e f ul l t r a c e a b il i t y , m e e t m c c ' s q u a l i t y s t a n d a r d s f o r h a n d li n g a n d s t o r a g e . m c c wi l l n o t p r o v i d e a n y w a rr a n ty c o v e r a g e o r o t h e r a s s i s t a n c e f o r p a r ts b o u g h t f r o m u n a u t h o r i z e d s o u r c e s. m c c i s c o m m i t t e d t o c o m b a t t h i s g l o b a l pr o b l e m a n d e n c ou r a g e o u r c u s t o m e r s t o d o t h e i r p a r t in s t o p p i n g t h i s p r a c t i c e b y b u y i n g d i r e c t o r f r o m a u t h o r i z ed d i s t r i b u t o r s.
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